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About MEMSPACK
Technology & Service
What is the Packaging?
Die Bonding
Wire Bonding
Encapsulation
Hermetic Sealing
Leak Test
R&D
Semiconductor Strain Gauge
Biosensor
Touch Motion Sensor
Gas Sensor
지적재산권
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연락처 정보
031-427-5535
shlee@memspack.co.kr
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